PCB Fabrication
Multilayer, HDI, RF, flex and rigid-flex boards, reviewed against your stackup and design requirements.
Explore CapabilitiesFrom bare boards to turnkey assembly. Connect fabrication, component sourcing and project coordination through one point of contact.
Choose the support your project needs, from bare PCB supply to component sourcing and assembly.
Multilayer, HDI, RF, flex and rigid-flex boards, reviewed against your stackup and design requirements.
Explore Capabilities →SMT and through-hole assembly with inspection and test scope defined for your project.
Review Quality Controls →Full or partial BOM sourcing, with approved part numbers and substitution requirements agreed before purchasing.
Discuss Your BOM →Coordinate board fabrication, parts procurement, assembly and agreed testing within one project workflow.
Discuss Your Project →Bring PCB fabrication, component sourcing and assembly together through one coordinated workflow. GlobalWin helps you connect your board requirements with the materials, components and manufacturing steps your project needs.
Start with your fabrication files, BOM and assembly requirements. We review the project details with you, clarify open technical questions and agree on the inspection and testing scope before the build.
Start Your Project →
View the board types and assemblies we review and supply.

Complex interconnects, controlled impedance and design-specific via structures.

High-frequency materials and hybrid stackups reviewed against your specification.

Flexible interconnects with bend, transition and coverlay requirements considered together.

Copper weight, conductor geometry and thermal requirements evaluated as a complete design.

Aluminum- and copper-base constructions with project-specific dielectric requirements.

SMT, BGA and mixed-technology assembly with inspection requirements agreed in advance.
Material, geometry and assembly requirements work together. We review the complete design before confirming feasibility and quotation.
Request a Project Review →| Project Area | Review Scope |
|---|---|
| PCB Construction | Rigid, multilayer, HDI, flex and rigid-flex |
| Materials | FR-4, high-Tg laminates, RF materials and metal-core constructions |
| Controlled Features | Impedance, blind and buried vias, microvias and via-in-pad |
| Surface Finishes | ENIG, ENEPIG, lead-free HASL, OSP and other specified finishes |
| Assembly | SMT, through-hole, BGA and mixed-technology builds |
| Inspection & Test | AOI, X-ray and project-defined electrical or functional testing |
Specific grades, dimensions, tolerances and process combinations require engineering confirmation.
Agree the inspection scope and acceptance criteria before production begins.



Review fabrication data, stackup, BOM and assembly inputs.
Define electrical and inspection requirements for the board construction.
Plan AOI and hidden-joint inspection per component type and acceptance criteria.
Evaluate programming, ICT and functional testing against supplied requirements.
Review the production and verification environments behind your project.


A coordinated process with technical and commercial approvals at the right stages.
Provide board data, quantity and delivery requirements. Add BOM and placement files for PCBA.
Clarify specifications, sourcing scope and testing requirements before confirming the quotation.
Confirm the file revision, approved components and build scope before production starts.
Complete agreed checks and coordinate packaging, documentation and shipment.
Provide Gerber or ODB++ data, drill files, quantity, stackup, board thickness, copper requirements and surface finish. Include impedance requirements and other controlled features where applicable.
Full and partial sourcing can be reviewed against your BOM. Include approved manufacturer part numbers and any restrictions on substitutions or component suppliers.
No. Functional testing and ICT require an agreed scope, including applicable fixtures, firmware, test procedures and acceptance criteria.
The schedule is confirmed during quotation based on technical requirements, material and component availability, quantity and the agreed inspection and testing scope.
Share your fabrication files, quantity and assembly requirements.